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| Datasheet File OCR Text: |
| Thermal Data DIP 40 40 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity 2.61 W/cmC 0.01 W/cmC leadframe die attach copper epoxy glue ( silver filler ) epoxy resin 0.25 mm 10-40 m molding compound 3.8 mm 0.0063W/cmC Charts enclosed : 1) Rth(j-a) vs power dissipation 2) Zth(j-a) vs time September 1999 1/2 Thermal Data Dip 40 Rth(j-a) (C/W) 65 1) 60 die size 35000 sq. mils dissipating area 2000 sq. mils 2 s 1 Oz. board 55 50 0 0.5 1 1.5 dissipated power ( Watt ) 2 2.5 3 Zth( C/W) 2) 10 die size 35000 sq. mils dissipating area 2000 sq. mils 2s 1Oz. board 2 w single square pulse 0.001 0.01 0.1 1 Time (s) 10 100 1,000 2/2 |
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